公开(公告)号：US20170302029A1

公开(公告)日：2017-10-19

申请号：US15469903

申请日：2017-03-27

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean De Dieu Mutangana

IPC: H01R13/6464 ,  H01R24/64

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469 ,  H01R24/64

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：US10050384B2

公开(公告)日：2018-08-14

申请号：US15469903

申请日：2017-03-27

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean De Dieu Mutangana

IPC: H01R13/6464 ,  H01R24/64 ,  H01R13/6461

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：US09634433B1

公开(公告)日：2017-04-25

申请号：US15097553

申请日：2016-04-13

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Roman J. Churnovic ,  Jean De Dieu Mutangana

IPC: H01R13/66 ,  H01R13/6467 ,  H01R13/6464 ,  H01R13/436 ,  H01R24/64

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6469 ,  H01R24/64

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.