- Patent Title: Array substrate and fabrication method thereof, and display panel
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Application No.: US15139655Application Date: 2016-04-27
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Publication No.: US10054831B2Publication Date: 2018-08-21
- Inventor: Binbin Chen
- Applicant: Xiamen Tianma Micro-electronics Co., Ltd. , Tianma Micro-electronics Co., Ltd.
- Applicant Address: CN Xiamen CN Shenzhen
- Assignee: Xiamen Tianma Micro-electronics Co., Ltd.,Tianma Micro-electronics Co., Ltd.
- Current Assignee: Xiamen Tianma Micro-electronics Co., Ltd.,Tianma Micro-electronics Co., Ltd.
- Current Assignee Address: CN Xiamen CN Shenzhen
- Agency: Anova Law Group, PLLC
- Priority: CN201610064991 20160129
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; G02F1/1333 ; G02F1/1362 ; G02F1/1335 ; G02F1/1368 ; H01L27/02 ; H01L27/12 ; H01L29/786

Abstract:
An array substrate and an array substrate fabrication method are provided. The array substrate comprises a base substrate, a first conductive layer, a first passivation layer including a plurality of first through-holes. a light-shielding layer including a plurality of first metal wires arranged in parallel, a second passivation layer including a plurality of second through-holes, and a first metal layer including a plurality of second metal wires arranged in parallel and one-to-one corresponding to the plurality of first metal wires. The first metal wire is electrically connected to the first conductive layer through at least one first through-hole, and the second metal wire is electrically connected to the corresponding first metal wire through at least one second through-hole. The array substrate includes a display region and a non-display region, and the first through-holes and the second through-holes are formed at the non-display region of the array substrate.
Public/Granted literature
- US20170219892A1 ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, AND DISPLAY PANEL Public/Granted day:2017-08-03
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