Invention Grant
- Patent Title: Assembly comprising a support frame and panel covers
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Application No.: US15172106Application Date: 2016-06-02
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Publication No.: US10065364B2Publication Date: 2018-09-04
- Inventor: Mark David Senatori
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Patent Department
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B29C65/54 ; G06F1/16 ; H05K5/03 ; B29K705/00 ; B29K709/08 ; B29L31/34

Abstract:
According to some examples, a housing assembly includes a support frame including an integrated pattern of channel cavities, a first panel cover adjacent a first side of the support frame, a second panel cover adjacent the support frame on a second side of the support frame, the second panel cover having a plurality of apertures, and a bonding material received in the channel cavities of the support frame through the plurality of apertures of the second panel cover.
Public/Granted literature
- US20160299535A1 ASSEMBLY COMPRISING A SUPPORT FRAME AND PANEL COVERS Public/Granted day:2016-10-13
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