Invention Grant
- Patent Title: Apparatuses and methods for heat transfer from packaged semiconductor die
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Application No.: US14920394Application Date: 2015-10-22
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Publication No.: US10068875B2Publication Date: 2018-09-04
- Inventor: David R. Hembree
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/38 ; H01L21/56 ; H01L25/18
Abstract:
Apparatuses and methods for heat transfer from packaged semiconductor die are described. For example, an apparatus may include a plurality of die in a stack, and a barrier in close proximity to at least an edge of each of the plurality of die. The apparatus may further include fill material in spaces between adjacent die of the plurality of die and in between the plurality of die and the barrier.
Public/Granted literature
- US20170117254A1 APPARATUSES AND METHODS FOR HEAT TRANSFER FROM PACKAGED SEMICONDUCTOR DIE Public/Granted day:2017-04-27
Information query
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