Invention Grant
- Patent Title: High speed bypass cable for use with backplanes
-
Application No.: US15433749Application Date: 2017-02-15
-
Publication No.: US10069225B2Publication Date: 2018-09-04
- Inventor: Christopher D. Wanha , Brian Keith Lloyd , Ebrahim Abunasrah , Rehan Khan , Javier Resendez , Michael Rost
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R13/514 ; H01R13/6471 ; H01R13/6474 ; H01R13/6587 ; H01R13/6592
Abstract:
A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
Public/Granted literature
- US20170162960A1 HIGH SPEED BYPASS CABLE FOR USE WITH BACKPLANES Public/Granted day:2017-06-08
Information query
