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公开(公告)号:US11842138B2
公开(公告)日:2023-12-12
申请号:US17477542
申请日:2021-09-17
申请人: Molex, LLC
发明人: Brian Keith Lloyd , Gregory Walz , Ayman Isaac , Kent E. Regnier , Bruce Reed
IPC分类号: G06F30/30 , G06F30/398 , G06F30/367 , G06F30/331 , G06F30/373
CPC分类号: G06F30/398 , G06F30/331 , G06F30/367 , G06F30/373
摘要: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to the chip package.
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公开(公告)号:US11165185B2
公开(公告)日:2021-11-02
申请号:US16649136
申请日:2018-09-19
申请人: Molex, LLC
IPC分类号: H01R13/502 , H01R13/658 , H01L23/34 , G02B6/42 , H05K7/20 , H01L23/473
摘要: A connector system includes a cage assembly in which a thermally conductive heat sink and a connector are mounted. The heat sink includes a base, a ramp extending downwardly from the base and a pedestal extending downwardly from the base. A thermal interface material is disposed on lower surface of the pedestal. A module can be inserted into the cage assembly and connected to the connector and to the heat sink. Thermal energy generated by the module is transferred to the heat sink which dissipates the heat by convention. The ramp protects a leading edge of the thermal interface material form engagement by the module during insertion of the module into the cage assembly.
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公开(公告)号:US11151300B2
公开(公告)日:2021-10-19
申请号:US16070636
申请日:2017-01-19
申请人: Molex, LLC
发明人: Brian Keith Lloyd , Gregory Walz , Ayman Isaac , Kent E. Regnier , Bruce Reed
IPC分类号: G06F30/30 , G06F30/398 , G06F30/373 , G06F30/367 , G06F30/331
摘要: A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to third connectors that are connected to the chip package.
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公开(公告)号:USRE48230E1
公开(公告)日:2020-09-29
申请号:US15715939
申请日:2017-09-26
申请人: Molex, LLC
发明人: Brian Keith Lloyd , Christopher David Hirschy , Munawar Ahmad , Eran J. Jones , Stephen W. Hamblin , Darian Ross Schulz , Todd David Ward , Gregory B. Walz , Ebrahim Abunasrah , Rehan Khan
IPC分类号: H01R13/58 , H01R13/6461 , H01B11/00 , H01R13/6471 , H01R13/6592 , H01R13/6593 , H05K1/02 , H05K3/22
摘要: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto. to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable, to allow signals to be transmitted at greater than 10 GHz with substantially lower loss than a traditional FR4 circuit board.
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公开(公告)号:US20180366890A1
公开(公告)日:2018-12-20
申请号:US16110727
申请日:2018-08-23
申请人: Molex, LLC
发明人: Brian Keith Lloyd , Gregory B. WALZ , Bruce REED , Gregory FITZGERALD , Ayman ISAAC , Kent E. REGNIER , Brandon JANOWIAK , Darian R. SCHULZ , Munawar AHMAD , Eran J. JONES , Javier RESENDEZ , Michael ROST
IPC分类号: H01R31/00 , H05K7/14 , H01R24/60 , G06F1/18 , H01R13/6583 , H01R13/717 , H01R12/79 , H01R13/66
摘要: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.
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公开(公告)号:US20180323525A1
公开(公告)日:2018-11-08
申请号:US16039495
申请日:2018-07-19
申请人: Molex, LLC
发明人: Christopher D. Wanha , Brian Keith Lloyd , Ebrahim Abunasrah , Rehan Khan , Javier Resendez , Michael Rost
IPC分类号: H01R12/70 , H01R13/6477 , H01R13/6581 , H01R13/6471 , H01R13/6473 , H01R13/514 , H01R13/6587 , H01R13/6474 , H01R13/6461 , H01R13/6592
CPC分类号: H01R12/7076 , H01R13/514 , H01R13/6461 , H01R13/6471 , H01R13/6473 , H01R13/6474 , H01R13/6477 , H01R13/6581 , H01R13/6587 , H01R13/6592 , Y10S439/941
摘要: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
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公开(公告)号:US10056706B2
公开(公告)日:2018-08-21
申请号:US15641777
申请日:2017-07-05
申请人: Molex, LLC
发明人: Christopher D. Wanha , Brian Keith Lloyd , Ebrahim Abunasrah , Rehan Khan , Javier Resendez , Michael Rost
IPC分类号: H01R12/00 , H01R12/70 , H01R13/514 , H01R13/6592 , H01R13/6474 , H01R13/6587 , H01R13/6471
CPC分类号: H01R12/7076 , H01R13/514 , H01R13/6461 , H01R13/6471 , H01R13/6473 , H01R13/6474 , H01R13/6477 , H01R13/6581 , H01R13/6587 , H01R13/6592 , Y10S439/941
摘要: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
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公开(公告)号:US09362678B2
公开(公告)日:2016-06-07
申请号:US14973095
申请日:2015-12-17
申请人: Molex, LLC
发明人: Christopher D. Wanha , Brian Keith Lloyd , Ebrahim Abunasrah , Rehan Khan , Javier Resendez , Michael Rost
IPC分类号: H01R9/03 , H01R13/6473 , H01R12/70 , H01R13/6592 , H01R13/6461
CPC分类号: H01R12/7076 , H01R13/514 , H01R13/6461 , H01R13/6471 , H01R13/6473 , H01R13/6474 , H01R13/6477 , H01R13/6581 , H01R13/6587 , H01R13/6592 , Y10S439/941
摘要: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
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公开(公告)号:US20210185820A1
公开(公告)日:2021-06-17
申请号:US17187896
申请日:2021-03-01
申请人: Molex, LLC
发明人: Brian Keith Lloyd , Bruce Reed , Gregory Walz , Colby Waggener , Chitaou Tsai
IPC分类号: H05K1/18 , H01L23/00 , H01R12/53 , H01R13/6594
摘要: A grid array connector system is provided that includes cables connected to pedestals that are mounted on a board. The cables include conductors that are connected to support vias positioned in openings in the board and the conductors are connected to the support vias.
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公开(公告)号:US10797416B2
公开(公告)日:2020-10-06
申请号:US16454080
申请日:2019-06-27
申请人: Molex, LLC
发明人: Brian Keith Lloyd , Gregory Fitzgerald , Bruce Reed , Gregory Walz , Ayman Isaac
IPC分类号: H01R12/70 , H01R12/73 , H01R12/79 , H01R13/518 , G06F13/38
摘要: A routing assembly for an electronic device has a front face with an array of connectors ports and each of the connector ports contain a first connector mounted therein. A first end of a cable can be directly terminated to the first connectors and the cables can be embedded in a tray that is configured to extend toward a chip package. The cables extend from the tray and terminates to a second connector that can be connected to the chip package so as to provide a communication path between the first connector and the second connector that substantially bypasses a supporting circuit board.
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