Invention Grant
- Patent Title: Power amplification module
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Application No.: US15837499Application Date: 2017-12-11
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Publication No.: US10069523B2Publication Date: 2018-09-04
- Inventor: Takayuki Tsutsui , Satoshi Tanaka , Hidenori Obiya
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2015-252115 20151224
- Main IPC: H04B1/16
- IPC: H04B1/16 ; H04B1/04

Abstract:
A power amplification module includes a first input terminal arranged to receive a first transmission signal in a first frequency band, a second input terminal arranged to receive a second transmission signal in a second frequency band higher than the first frequency band, a first amplification circuit that amplifies the first transmission signal, a second amplification circuit that amplifies the second transmission signal, a first filter circuit located between the first input terminal and the first amplification circuit, and a second filter circuit located between the second input terminal and the second amplification circuit. The first filter circuit is a low-pass filter that allows the first frequency band to pass therethrough and that attenuates a harmonic of the first transmission signal and the second transmission signal. The second filter circuit is a high-pass filter that allows the second frequency band to pass therethrough and that attenuates the first transmission signal.
Public/Granted literature
- US20180102801A1 POWER AMPLIFICATION MODULE Public/Granted day:2018-04-12
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