Invention Grant
- Patent Title: Printhead assembly with fluid interconnect cover
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Application No.: US15260044Application Date: 2016-09-08
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Publication No.: US10071557B2Publication Date: 2018-09-11
- Inventor: Rhonda L. Wilson , Mark A. Devries
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/045

Abstract:
In one example implementation, a printhead assembly includes a fluid intake section, a fluid interconnect integrated with the fluid intake section to receive fluid from an ink supply assembly, and an air-permeable, fluid-resistant, fluid interconnect cover installed over the fluid interconnect.
Public/Granted literature
- US20160375689A1 PRINTHEAD ASSEMBLY WITH FLUID INTERCONNECT COVER Public/Granted day:2016-12-29
Information query
IPC分类: