Invention Grant
- Patent Title: Composition for preparing article containing poly(imide-amide), method of preparing the same, and article containing poly(imide-amide)
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Application No.: US14744621Application Date: 2015-06-19
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Publication No.: US10072180B2Publication Date: 2018-09-11
- Inventor: Sungwon Choi , Chanjae Ahn , Sungwoo Hong , Byunghee Sohn , Hyunjeong Jeon , Kyeong-sik Ju
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
- Applicant Address: KR Gyeonggi-Do KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2015-0015219 20150130
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C09D179/08 ; B32B27/08 ; C08G73/14
Abstract:
A composition for preparing an article including a poly(imide-amide) copolymer, the composition including (i) a copolymer obtained by reacting a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and a carboxylic acid dichloride to form a reaction product, followed by removing hydrochloric acid from the reaction product, (ii) an acid anhydride, and (iii) a solvent: Wherein group R1 in Chemical Formula 1 and group R2 in Chemical Formula 2 are the same as described in the specification.
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