- 专利标题: Indirect evaporator cooler heat exchanger manufacturing method
-
申请号: US14898287申请日: 2013-06-28
-
公开(公告)号: US10072901B2公开(公告)日: 2018-09-11
- 发明人: Ozan Tutunoglu , John H. Bean, Jr. , Mohammed Adil , Roy L. Grantham
- 申请人: SCHNEIDER ELECTRIC IT CORPORATION
- 申请人地址: US RI West Kingston
- 专利权人: SCHNEIDER ELECTRIC IT CORPORATION
- 当前专利权人: SCHNEIDER ELECTRIC IT CORPORATION
- 当前专利权人地址: US RI West Kingston
- 代理机构: Lando & Anastasi, LLP
- 国际申请: PCT/US2013/048506 WO 20130628
- 国际公布: WO2014/209345 WO 20141231
- 主分类号: F28F9/02
- IPC分类号: F28F9/02 ; F28F9/04 ; B21D53/08 ; F28F1/40 ; F28F21/06 ; F28F1/02 ; F28F9/16 ; F28D1/053 ; H05K7/20 ; B23P15/26 ; F28D21/00
摘要:
A method for constructing a module of a modular cooling unit includes acquiring a plurality of tubes, each tube having a first end and a second end, and overmolding a first header onto the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a plurality of parallel first slots, each slot of the parallel first slots having an extended surface configured to receive and retain the first end of the tube.
公开/授权文献
信息查询