Invention Grant
- Patent Title: Method of fabricating a lead frame by additive process
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Application No.: US14969481Application Date: 2015-12-15
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Publication No.: US10074596B2Publication Date: 2018-09-11
- Inventor: Fabio Marchisi
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Slater Matsil, LLP
- Priority: ITTO2015A0231 20150424
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H05K7/18 ; H01L21/56 ; H01L21/768 ; H01L21/48 ; H01L23/00 ; H01L23/31
Abstract:
An electronic component, such as an integrated circuit, includes at least one circuit having coupled therewith electrical connections including a lead frame of electrically conductive material. The lead frame is produced by an additive process of conductive material, e.g., by 3D printing, by forming a three-dimensional structure of leads having overlapping surfaces with a gap therebetween.
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Information query
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