Invention Grant
- Patent Title: Bond pads with differently sized openings
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Application No.: US14821228Application Date: 2015-08-07
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Publication No.: US10074624B2Publication Date: 2018-09-11
- Inventor: Vikram Venkatadri
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US IA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US IA Norwood
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.
Public/Granted literature
- US20170040275A1 BOND PADS WITH DIFFERENTLY SIZED OPENINGS Public/Granted day:2017-02-09
Information query
IPC分类:
