A signal isolator integrated circuit package includes a first die in a first voltage domain and a second die in a second voltage domain. The integrated circuit package also includes a first signal path from the first die to the second die via a first isolation barrier supported by the first die. The first isolation barrier includes a first conductive layer disposed over a surface of the first die and a first insulating layer disposed over the first conductive layer. The first isolation barrier also includes a second insulating layer disposed over the first insulating layer and a second conductive layer disposed over the second insulating layer. A first floating conductive plate is disposed between the first insulating layer and the second insulating layer.