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    Packaged current sensor integrated circuit
    1.
    发明授权
    Packaged current sensor integrated circuit 有权

    公开(公告)号：US12163983B2

    公开(公告)日：2024-12-10

    申请号：US18053480

    申请日：2022-11-08

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Robert A. Briano ,  Natasha Healey

    IPC: G01R15/20 ,  G01R19/00 ,  H01L21/66 ,  H01L23/495

    Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by one or more magnetic sensing elements supported by a semiconductor die adjacent to the primary conductor. A method of fabricating the packaged current sensor integrated circuit includes partially encasing the lead frame in a first mold material, applying an insulator to one or more die attach pads, attaching a die to the insulator, electrically connecting the die to secondary leads, and providing a second mold to the subassembly. The package is configured to provide increased voltage isolation.

    Signal isolator with three state data transmission
    5.
    发明授权
    Signal isolator with three state data transmission 有权

    公开(公告)号：US11115244B2

    公开(公告)日：2021-09-07

    申请号：US16809825

    申请日：2020-03-05

    Applicant: Allegro MicroSystems, LLC

    Inventor： Robert A. Briano ,  Pedram Sotoodeh Shahnani ,  Cory Voisine

    IPC: H04L25/02 ,  H04B17/17 ,  H03K19/00

    Abstract: A signal isolator integrated circuit package includes a first circuit having a first input and a first output, a second circuit having a second input and a second output, an isolation barrier layer between the first circuit and the second circuit, wherein the second output of the second circuit is coupled to the first input of the first circuit through the isolation barrier. The signal isolator includes a comparator configured to compare the first input of the first circuit to the second output of the second circuit. The second output can be configured to convey at least three states, including a first state indicative of a logical high of an input signal received at the first input, a second state indicative of a logical low of the input signal, and a third state indicative of a fault condition.

    PACKAGED CURRENT SENSOR INTEGRATED CIRCUIT
    7.
    发明公开
    PACKAGED CURRENT SENSOR INTEGRATED CIRCUIT 审中-公开

    公开(公告)号：US20240047314A1

    公开(公告)日：2024-02-08

    申请号：US18490815

    申请日：2023-10-20

    Applicant: Allegro MicroSystems, LLC

    Inventor： Robert A. Briano ,  Shixi Louis Liu

    IPC: H01L23/495 ,  H01L23/31 ,  H10N52/00 ,  G01R15/20 ,  G01R19/00

    CPC classification number: H01L23/49541 ,  H01L23/3107 ,  H10N52/00 ,  G01R15/202 ,  G01R19/0092 ,  H01L2224/48245 ,  H01L24/48

    Abstract: A current sensor integrated circuit package includes a primary conductor having an input portion and an output portion, both with reduced area edges. Secondary leads each have an exposed portion and an elongated portion that is offset with respect to the exposed portion. A semiconductor die is disposed adjacent to the primary conductor on an insulator portion and at least one magnetic field sensing element is supported by the semiconductor die. A package body includes a first portion enclosing the semiconductor die and a portion of the primary conductor and a second portion enclosing the elongated portion of the plurality of secondary leads. The first package body portion has a first width configured to expose the input and output portions of the primary conductor and the second package body portion has a second width between a first and second package body side edges that is larger than the first width.

    Signal isolator having at least one isolation island
    9.
    发明授权
    Signal isolator having at least one isolation island 有权

    公开(公告)号：US11342288B2

    公开(公告)日：2022-05-24

    申请号：US16430849

    申请日：2019-06-04

    Applicant: Allegro MicroSystems, LLC

    Inventor： Robert A. Briano ,  Alejandro Gabriel Milesi

    IPC: H01L23/64 ,  H01L23/66 ,  H01L23/552 ,  H03H7/00 ,  H04L25/02

    Abstract: Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.

    Differential current sensor
    10.
    发明授权
    Differential current sensor 有权

    公开(公告)号：US11320466B1

    公开(公告)日：2022-05-03

    申请号：US17083487

    申请日：2020-10-29

    Applicant: Allegro MicroSystems, LLC

    Inventor： Robert A. Briano ,  Wade Bussing ,  Timothy A. Clark

    IPC: G01R19/10 ,  G01R19/15

    Abstract: Methods and apparatus for measuring a current difference between at least two current traces in a circuit board. Each wire or trace generates a magnetic field which may then be measured by at least one magnetic field sensing element positioned on an integrated circuit, such as a current sensor integrated circuit or a differential magnetic field sensor integrated circuit. An output disconnect signal may be provided from the current sensor or differential magnetic field sensing integrated circuit to indicate that a current difference above a predetermined threshold exists in the two or more current traces.

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