A metallized film capacitor includes a metallized film columnar body in which metallized films are stacked or wound, an external lead-out terminal, and a metal sprayed portion to which the external lead-out terminal is joined and that is provided in the metallized film columnar body. The metallized film columnar body includes (i) a metal deposition film includes (a) a non-slit-forming region that does not includes a non-deposition slit and (b) a slit-forming region including plural non-deposition slits and fuse portions that are present between the non-deposition slits, (ii) insulating non-melting films that are provided on at least the fuse portions closest to the non-slit-forming region and do not melt due to heat generated from fuse portions, and (iii) a dielectric film.