An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n  Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.