公开(公告)号：US10829669B2

公开(公告)日：2020-11-10

申请号：US15875391

申请日：2018-01-19

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C09J11/06 ,  C09J163/00 ,  C09J171/02 ,  C09J145/00 ,  H01L51/52 ,  C08K5/55 ,  C09D163/00 ,  H01L51/44 ,  H01L23/31 ,  C08K5/057 ,  H01L51/00 ,  C08K3/24

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

公开(公告)号：US10043996B2

公开(公告)日：2018-08-07

申请号：US14868088

申请日：2015-09-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami Aoyama ,  Tetsuya Mieda ,  Keiji Saito ,  Kunihiko Ishiguro ,  Toshimitsu Nakamura ,  Naoaki Mihara ,  Takumi Asanuma

IPC: H01L51/52 ,  H01L51/00 ,  C08L65/00

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

公开(公告)号：US10988646B2

公开(公告)日：2021-04-27

申请号：US16008675

申请日：2018-06-14

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C09J163/00 ,  C09J5/00 ,  C08G59/22 ,  C08G59/68 ,  B32B27/38 ,  C08F2/48 ,  C08G59/42 ,  C08L71/02 ,  C09J133/08 ,  C09J133/10

Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.

公开(公告)号：US09758690B2

公开(公告)日：2017-09-12

申请号：US14750577

申请日：2015-06-25

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kunihiko Ishiguro ,  Tetsuya Mieda ,  Keiji Saito ,  Masami Aoyama ,  Toshimitsu Nakamura ,  Naoaki Mihara ,  Takumi Asanuma

IPC: C09D125/08 ,  C09D193/04 ,  C09D109/06 ,  C09D123/22 ,  C08K5/01 ,  C08K5/56 ,  C08K5/057 ,  C08K5/00 ,  C08L53/02 ,  H01L51/52

CPC classification number: C09D125/08 ,  C08K5/0091 ,  C08K5/01 ,  C08K5/057 ,  C08K5/07 ,  C08K5/56 ,  C08L53/025 ,  C08L57/02 ,  C09D109/06 ,  C09D123/22 ,  C09D193/04 ,  H01L51/524

Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y

公开(公告)号：US10556974B2

公开(公告)日：2020-02-11

申请号：US15663371

申请日：2017-07-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C07F5/06 ,  C07F7/00 ,  C08F20/06 ,  C08F20/18 ,  C08F2/48

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.

公开(公告)号：US10196534B2

公开(公告)日：2019-02-05

申请号：US15248041

申请日：2016-08-26

Applicant: Furukawa Electric Co., Ltd.

Inventor： Takumi Asanuma ,  Masami Aoyama ,  Yasushi Ishizaka ,  Tetsuya Mieda

IPC: H01L31/042 ,  H02N6/00 ,  C09D115/00 ,  C08F2/44 ,  H01L31/048 ,  C08F2/48 ,  H01L51/10 ,  H01L51/44 ,  C08F290/04 ,  C09K3/10 ,  C09D123/20 ,  C09D123/22 ,  C09D157/02 ,  H01L23/29 ,  H01L51/52 ,  C09D7/63 ,  C08K5/07

Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

公开(公告)号：US11845865B2

公开(公告)日：2023-12-19

申请号：US17095679

申请日：2020-11-11

Applicant: Furukawa Electric Co., Ltd.

Inventor： Takumi Asanuma ,  Hideyuki Ikeda ,  Shota Sugiyama

IPC: C08L81/06 ,  C08L71/02

CPC classification number: C08L81/06 ,  C08L71/02

Abstract: The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process.
A thermoplastic resin film, which is a resin composite of a first resin component that is a crystalline thermoplastic resin having a melting point of 290° C. or higher and a second resin component that has a glass transition temperature of 150° C. or higher, wherein the crystallinity of the first resin component is more than 5.0% of the entire resin composite.

公开(公告)号：US10196547B2

公开(公告)日：2019-02-05

申请号：US15248366

申请日：2016-08-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami Aoyama ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: H02N6/00 ,  H01L31/042 ,  C09J119/00 ,  C08F299/00 ,  H01L51/52 ,  H01L31/048 ,  C09K3/10 ,  H01L23/29 ,  H01L51/00 ,  H01L51/44

Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

公开(公告)号：US10079360B2

公开(公告)日：2018-09-18

申请号：US15663032

申请日：2017-07-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka ,  Keiji Saito

IPC: H01L51/52 ,  H01L23/29 ,  H05B33/04 ,  H01L23/31 ,  C09K3/10 ,  B01J20/22 ,  B01D53/28

CPC classification number: H01L51/524 ,  B01D53/02 ,  B01D53/261 ,  B01D53/28 ,  B01D2253/20 ,  B01J20/223 ,  B01J20/264 ,  B01J20/267 ,  B01J2220/66 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L51/5259 ,  H05B33/04

Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n  Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.

公开(公告)号：US20160362587A1

公开(公告)日：2016-12-15

申请号：US15248366

申请日：2016-08-26

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami AOYAMA ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C09J119/00 ,  H01L51/52 ,  H01L23/29 ,  H01L51/00 ,  H01L31/048

CPC classification number: C09J119/006 ,  C08F299/00 ,  C09K3/1006 ,  C09K2200/0617 ,  H01L23/293 ,  H01L31/0481 ,  H01L51/004 ,  H01L51/448 ,  H01L51/5246 ,  H01L2924/0002 ,  Y02E10/549 ,  C08K5/50 ,  C08K5/07 ,  H01L2924/00

Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

Abstract translation: 其中R 1和R 2各自表示羟基或H 2C≡C（R 7）-COO-; R3和R4各自表示C1-C16取代或未取代的，非含N的二价有机基团; R5，R6和R7各自表示氢原子或C1-C10烷基; l和m各自表示0或1; n表示15〜150的整数， x：y = 0〜100：100〜0; R1和R2不能都是羟基。