Invention Grant
- Patent Title: Attenuation reduction structure for flexible circuit board
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Application No.: US15920915Application Date: 2018-03-14
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Publication No.: US10080277B1Publication Date: 2018-09-18
- Inventor: Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
- Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- Applicant Address: TW Taoyuan County
- Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW106109226A 20170317
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K1/09

Abstract:
A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
Public/Granted literature
- US20180270947A1 ATTENUATION REDUCTION STRUCTURE FOR FLEXIBLE CIRCUIT BOARD Public/Granted day:2018-09-20
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