公开(公告)号：US09577304B2

公开(公告)日：2017-02-21

申请号：US14637898

申请日：2015-03-04

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Chih-Heng Chuo ,  Gwun-Jin Lin ,  Kuo-Fu Su

IPC: H03H7/38 ,  H01P1/22 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01P1/227 ,  H03H7/38 ,  H05K1/0225 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09718 ,  H05K2201/10931

Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。

公开(公告)号：US09313890B2

公开(公告)日：2016-04-12

申请号：US14478322

申请日：2014-09-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Chih-Heng Chuo ,  Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/118 ,  H05K1/024 ,  H05K1/025 ,  H05K1/117 ,  H05K2201/0191

Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。

公开(公告)号：US09040835B2

公开(公告)日：2015-05-26

申请号：US14108790

申请日：2013-12-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su ,  Chih-Heng Chuo

IPC: H05K1/00 ,  H05K1/11 ,  H02G15/08 ,  H05K9/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0245 ,  H05K1/0225 ,  H05K1/118 ,  H05K3/4069 ,  H05K2201/09845

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract translation: 柔性电路板的差分信号传输线的衰减降低接地结构包括柔性基板，在该柔性基板上至少有一对差模信号线，至少一个接地线，覆盖绝缘层和薄金属箔 形成层。 至少一个通孔延伸穿过薄金属箔层和覆盖绝缘层，并且对应于接地线的导电接触区。 通孔填充有导电膏层，以将薄金属箔层电连接到接地线的导电接触区域，以提供良好的接地布置。 薄金属箔层包括形成在对应于差模信号线的顶角的位置处的多个开口。

公开(公告)号：US08753143B2

公开(公告)日：2014-06-17

申请号：US13649184

申请日：2012-10-11

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin ,  Chih-Heng Chuo

IPC: H01R12/00

CPC classification number: H01R4/024 ,  H01R12/594 ,  H01R12/65 ,  H01R12/79

Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.

Abstract translation: 用于柔性电路电缆的连接结构包括柔性电路电缆，该柔性电路电缆具有柔性电路基板，该电路基板的第一端与连接器外壳的焊台相连接，该第一端分别对应于电缆的柔性电路电缆的导线的第一指垫导电触点 连接器的金属导电端子的焊接部分。 在每个导电线的第一指垫导电接触件的金属涂层和相应的金属导电端子的电缆焊接部分之间形成焊接层，以将柔性电路电缆的导线设置成与金属电连接 连接器的导电端子。

公开(公告)号：US10080277B1

公开(公告)日：2018-09-18

申请号：US15920915

申请日：2018-03-14

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09

Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

公开(公告)号：US09942984B1

公开(公告)日：2018-04-10

申请号：US15664031

申请日：2017-07-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/09 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/09 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/028 ,  H05K1/0393 ,  H05K9/0084 ,  H05K2201/0715 ,  H05K2201/0723

Abstract: A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

公开(公告)号：US09398692B2

公开(公告)日：2016-07-19

申请号：US14446605

申请日：2014-07-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/058

Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.

Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。

公开(公告)号：US09155208B2

公开(公告)日：2015-10-06

申请号：US14138383

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K3/4061 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/118 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1572

Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

Abstract translation: 用于柔性电路板的导电布线层的导电连接结构包括形成在包括导电布线层，第一覆盖层和第二覆盖层的叠层结构中的第一通孔和第二通孔。 第一通孔延伸穿过第一覆盖层和导电布线层。 第二通孔延伸穿过第二覆盖层。 第二通孔形成在与导电布线层的第二表面上的暴露区相对应的位置处，并与第一通孔连通。 第一导电浆料层形成在第一覆盖层的表面上并填充在第一通孔中，以在第一通孔中形成柱部分。 柱部具有形成弯曲帽的底端。 导电布线层的第二表面的暴露区域至少部分被弯曲的盖子覆盖。

公开(公告)号：US09077168B2

公开(公告)日：2015-07-07

申请号：US13690344

申请日：2012-11-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su

IPC: H01B7/08 ,  H02G15/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H02G15/08 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09254

Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.

Abstract translation: 差分模式信号传输模块包括具有外部连接端的第一部分，在该第一部分上形成有至少一对差模信号传输端子，并且包括接地端子，第一差分模式信号端子和第二差分模式信号端子。 第一部分的延伸连接端形成与外部连接端对应的对应信号端子。 在第一部分上形成至少一个第一导电连接线。 导电连接线将第一部分的外部连接端的接地端子连接到集合接地点。 第一部分的延伸连接端连接到扩展部分。 延伸部分进一步连接到与第一部分相对的第二部分。 延伸部分包括至少一条狭缝线以形成捆扎部分。 第一部分，第二部分和扩展部分包括至少一个折线。

公开(公告)号：US09462685B2

公开(公告)日：2016-10-04

申请号：US14090157

申请日：2013-11-26

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su ,  Chih-Heng Chuo

IPC: H05K1/02 ,  B29C53/04

CPC classification number: H05K1/028 ,  B29C53/04 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/057 ,  H05K2201/09063 ,  H05K2203/0195 ,  Y10T29/49826

Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组合的方法和结构。 通过将预折线作为中心线来处理预成形的柔性电路板，以将柔性电路板的连接部分朝向端子分配部分折叠。 然后，将连接部朝向端子分配部的方向卷绕，以使连接部形成卷边体。 然后将卷绕的物体穿过铰链组件的孔，以使轧制体完全延伸穿过铰链组件的孔，使得柔性电路板的延伸部分定位在铰链组件的孔中，并且第一端 并且第二端分别位于铰链组件的孔的相对侧。