Invention Grant
- Patent Title: Methods and apparatus for a semiconductor device having bi-material die attach layer
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Application No.: US15470486Application Date: 2017-03-27
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Publication No.: US10083896B1Publication Date: 2018-09-25
- Inventor: Rongwei Zhang , Vikas Gupta
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/495 ; H01L23/00 ; H01L21/48
Abstract:
Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.
Public/Granted literature
- US20180277461A1 METHODS AND APPARATUS FOR A SEMICONDUCTOR DEVICE HAVING BI-MATERIAL DIE ATTACH LAYER Public/Granted day:2018-09-27
Information query
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