Invention Grant
- Patent Title: Apparatus and method of measuring stress
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Application No.: US14792674Application Date: 2015-07-07
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Publication No.: US10085682B2Publication Date: 2018-10-02
- Inventor: Joonhyung Lee , Sangkyu Kim , Seongho Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0110957 20140825
- Main IPC: A61B5/1455
- IPC: A61B5/1455 ; A61B5/16 ; A61B5/145 ; A61B5/00

Abstract:
Provided is an apparatus and method of measuring stress. The apparatus includes: a light source configured to emit light to the subject; a sensor configured to measure light reflected from the subject; a data extractor configured to obtain, from the reflected light, data that indicates at least one object material included in the subject; and a data processor configured to generate information about the stress of the subject based on a correlation between the obtained data and a reference value of stress.
Public/Granted literature
- US20160051175A1 APPARATUS AND METHOD OF MEASURING STRESS Public/Granted day:2016-02-25
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