Invention Grant
- Patent Title: Method and apparatus for forming interface between coaxial cable and connector
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Application No.: US15065468Application Date: 2016-03-09
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Publication No.: US10090626B2Publication Date: 2018-10-02
- Inventor: Frank A. Harwath , Jeffrey D. Paynter , James P. Fleming , David J. Smentek
- Applicant: CommScope Technologies LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Myers Bigel, P.A.
- Main IPC: H01R43/02
- IPC: H01R43/02 ; B23K3/08 ; B23K3/047 ; H01R9/05
Abstract:
A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the solder element is positioned within a vacuum chamber; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with a mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.
Public/Granted literature
- US20160268754A1 METHOD AND APPARATUS FOR FORMING INTERFACE BETWEEN COAXIAL CABLE AND CONNECTOR Public/Granted day:2016-09-15
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