Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and substrate processing liquid
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Application No.: US15264960Application Date: 2016-09-14
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Publication No.: US10096486B2Publication Date: 2018-10-09
- Inventor: Shinsuke Muraki , Katsuhiro Sato , Hiroaki Yamada
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-018162 20160202
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01L21/3213 ; C23F1/16 ; H01L21/67 ; C23F1/14 ; C23F1/18

Abstract:
In one embodiment, a substrate processing liquid contains phosphoric acid as a primary component and contains water and ketone. In another embodiment, a substrate processing method includes processing a substrate in a substrate processing bath with a substrate processing liquid containing phosphoric acid, water and ketone. The method further includes discharging the substrate processing liquid from the substrate processing bath to a circulating flow channel, heating the substrate processing liquid flowing through the circulating flow channel at a temperature between 50° C. and 90° C., and supplying the substrate processing liquid again from the circulating flow channel to the substrate processing bath to circulate the substrate processing liquid under heating.
Public/Granted literature
- US20170221725A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING LIQUID Public/Granted day:2017-08-03
Information query
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