Invention Grant
- Patent Title: Composition for preparing polyimide, polyimide, and article including same
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Application No.: US14550716Application Date: 2014-11-21
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Publication No.: US10100151B2Publication Date: 2018-10-16
- Inventor: Jungha Chae , Byung Hee Sohn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2013-0144125 20131125; KR10-2014-0162857 20141120
- Main IPC: B32B27/32
- IPC: B32B27/32 ; C08G73/10 ; C08J5/18 ; G02F1/1333 ; C09D179/08
Abstract:
A composition for preparing a polyimide including a tetracarboxylic dianhydride mixture including a tetracarboxylic dianhydride represented by Chemical Formula 1A, Chemical Formula 1B, or a combination thereof, a tetracarboxylic dianhydride represented by Chemical Formula 2, and a diamine represented by Chemical Formula 3: NH2—R1—NH2 Chemical Formula 3 wherein in Chemical Formulae 1A, 1B, 2 and 3, definitions of groups and substituents are described in the specification.
Public/Granted literature
- US20150147554A1 COMPOSITION FOR PREPARING POLYIMIDE, POLYIMIDE, AND ARTICLE INCLUDING SAME Public/Granted day:2015-05-28
Information query
