Invention Grant
- Patent Title: Connector port frame for processor package
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Application No.: US15377254Application Date: 2016-12-13
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Publication No.: US10109940B2Publication Date: 2018-10-23
- Inventor: Thomas A. Boyd , Feifei Cheng , Donald T. Tran , Russell S. Aoki , Karumbu Meyyappan
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/88

Abstract:
Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20180166807A1 CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE Public/Granted day:2018-06-14
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