Invention Grant
- Patent Title: Thermoelastic cooling
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Application No.: US13431768Application Date: 2012-03-27
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Publication No.: US10119059B2Publication Date: 2018-11-06
- Inventor: Jun Cui , Ichiro Takeuchi , Manfred Wuttig , Yiming Wu , Reinhard Radermacher , Yunho Hwang , Jan Muehlbauer
- Applicant: Jun Cui , Ichiro Takeuchi , Manfred Wuttig , Yiming Wu , Reinhard Radermacher , Yunho Hwang , Jan Muehlbauer
- Applicant Address: US IA Ames US MD College Park
- Assignee: Jun Cui,THE UNIVERSITY OF MARYLAND
- Current Assignee: Jun Cui,THE UNIVERSITY OF MARYLAND
- Current Assignee Address: US IA Ames US MD College Park
- Agency: Chen Yoshimura LLP
- Main IPC: F25B23/00
- IPC: F25B23/00 ; C09K5/14
Abstract:
A cooling system based on thermoelastic effect is provided. The system comprises a heat sink, a refrigerated space and a regenerator coupled to the refrigerated space and to the heat sink to pump heat from the refrigerated space to the heat sink. The regenerator comprises solid thermoelastic refrigerant materials capable of absorbing or releasing heat.
Public/Granted literature
- US20120273158A1 THERMOELASTIC COOLING Public/Granted day:2012-11-01
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