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1543 条记录 (耗时 0.059 秒)

    P-type SnSe crystal capable of being used as thermoelectric refrigeration material and preparation method thereof
    1.
    发明授权
    P-type SnSe crystal capable of being used as thermoelectric refrigeration material and preparation method thereof 有权

    公开(公告)号：US11629431B2

    公开(公告)日：2023-04-18

    申请号：US17551265

    申请日：2021-12-15

    申请人： Beihang University

    发明人： Lidong Zhao ,  Bingchao Qin ,  Xiao Zhang

    IPC分类号： C30B9/04 ,  C30B29/46 ,  C09K5/14

    摘要： The present disclosure relates to P-type SnSe crystal capable of being used as thermoelectric refrigeration material and a preparation method thereof. The material is a Na-doped and Pb-alloyed SnSe crystal. A molar ratio of Sn, Se, Pb and Na is (1-x-y):1:y:x, where 0.015≤x≤0.025 and 0.05≤y≤0.11. The P-type SnSe crystal provided by the present disclosure is capable of being used as the thermoelectric refrigeration material. A power factor PF of the P-type SnSe crystal at a room temperature is ≥70 μWcm−1K−2, and ZT at the room temperature is ≥1.2. A single-leg temperature difference measurement platform built on the basis of the obtained SnSe crystal may realize a refrigeration temperature difference of 17.6 K at a current of 2 A. The present disclosure adopts a modified directional solidification method and uses a continuous temperature region for slow cooling to grow a crystal to obtain the large-sized high-quality SnSe crystal.

    HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET
    5.
    发明申请
    HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET 有权

    公开(公告)号：US20230052370A1

    公开(公告)日：2023-02-16

    申请号：US17792835

    申请日：2021-03-18

    申请人： DENKA COMPANY LIMITED

    发明人： Kosuke WADA ,  Yoshitaka TANIGUCHI

    IPC分类号： C09K5/14 ,  C08K3/38 ,  C08J3/20 ,  C08J5/18

    摘要： A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

    Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
    7.
    发明授权
    Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure 有权

    公开(公告)号：US11578245B2

    公开(公告)日：2023-02-14

    申请号：US16633441

    申请日：2018-07-11

    申请人： DOW TORAY CO., LTD.

    发明人： Kenji Ota

    IPC分类号： C08L83/04 ,  C09K5/14 ,  H01M10/613 ,  H01M10/655 ,  C08J3/075 ,  C08K3/00 ,  H05K1/02 ,  C08G77/12 ,  C08G77/20 ,  C08G77/14

    摘要： Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

    Sound-absorbing material, preparation method thereof and speaker using same
    9.
    发明授权
    Sound-absorbing material, preparation method thereof and speaker using same 有权

    公开(公告)号：US11570544B1

    公开(公告)日：2023-01-31

    申请号：US17549887

    申请日：2021-12-14

    申请人： AAC Microtech (Changzhou) Co., Ltd.

    发明人： Hezhi Wang

    IPC分类号： H04R1/28 ,  G10K11/162 ,  H04R1/02 ,  C09K5/14

    摘要： Provided is a sound-absorbing material, including an adsorbent material and a thermal conductive material. The thermal conductive material is uniformly dispersed in the sound-absorbing material. The thermal conductive material includes a carbon fiber material, and a weight ratio of the carbon fiber material in the sound-absorbing material is within a range of 0.05% to 10%. Further provided are a preparation method of the sound-absorbing material and a speaker using the sound-absorbing material. The sound-absorbing material has higher thermal conductivity and can be added to a rear cavity of the speaker to effectively conduct heat generated when the speaker is working, thereby improving the heat dissipation performance of the speaker.