公开(公告)号：US20240327301A1

公开(公告)日：2024-10-03

申请号：US18438645

申请日：2024-02-12

申请人： NGK INSULATORS, LTD.

发明人： Kana IBATA ,  Asumi NAGAI ,  Katsuhiro INOUE

IPC分类号： C04B37/00 ,  B32B18/00 ,  C04B35/56 ,  C04B35/58 ,  C04B37/02 ,  C09K5/14 ,  C22C32/00 ,  H01L21/683

CPC分类号： C04B37/001 ,  B32B18/00 ,  C04B35/5626 ,  C04B35/58092 ,  C04B37/021 ,  C09K5/14 ,  C22C32/0047 ,  H01L21/6833 ,  C04B2235/3826 ,  C04B2235/3847 ,  C04B2235/3891 ,  C04B2235/404 ,  C04B2235/85 ,  C04B2235/9607 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/403

摘要： A composite material sintered body includes silicon carbide, tungsten silicide, and tungsten carbide, contains 14.4 wt % or more and 48.6 wt % or less of silicon carbide, and has an open porosity of 1% or less.

公开(公告)号：US12104008B2

公开(公告)日：2024-10-01

申请号：US16994220

申请日：2020-08-14

申请人： STEPAN COMPANY

发明人： Zhenhua Cui ,  Warren A. Kaplan ,  Sarah Wolek

IPC分类号： C08G59/06 ,  C08G18/42 ,  C08G18/48 ,  C08G59/14 ,  C08G63/06 ,  C08G65/331 ,  C08G65/34 ,  C08J9/00 ,  C09K5/14

CPC分类号： C08G59/063 ,  C08G18/4294 ,  C08G18/4895 ,  C08G59/14 ,  C08G63/06 ,  C08G65/331 ,  C08G65/34 ,  C08J9/0009 ,  C09K5/14 ,  C08G2110/0008 ,  C08G2110/0025 ,  C08G2115/02 ,  C08J2205/10 ,  C08J2375/06 ,  C08J2375/08 ,  Y02E60/14

摘要： Polyether- or polyester-epoxide polymer (PEEP) compositions are disclosed. The compositions comprise reaction products of a polyepoxide compound and a polyol composition. The polyol composition has a melting point within the range of 20° C. to 100° C. and a hydroxyl number less than 35 mg KOH/g. The PEEP composition is a solid-solid phase-change material. As measured by differential scanning calorimetry (DSC) at a heating/cooling rate of 10° C./minute, the PEEP composition has a transition temperature within the range of −10° C. to 70° C., a latent heat at the transition temperature within the range of 30 to 200 J/g, and little or no detectable hysteresis or supercooling upon thermal cycling over at least five heating/cooling cycles that encompass the transition temperature. The PEEP compositions should enable formulators to manage thermal energy changes in many practical applications, including automotive, marine or aircraft parts, building materials, appliance insulation, electronics, textiles, garments, and paints or coatings.

公开(公告)号：US12100637B2

公开(公告)日：2024-09-24

申请号：US17187397

申请日：2021-02-26

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae Ho Chung ,  Soo Ho Noh ,  Jin Seok Park ,  Se Young Jang

IPC分类号： H01L23/367 ,  C09K5/14 ,  G06F1/20 ,  H01L23/373 ,  H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC分类号： H01L23/3675 ,  C09K5/14 ,  G06F1/20 ,  G06F1/203 ,  H01L23/3736 ,  H05K1/0203 ,  H05K7/20 ,  H05K7/20209 ,  H05K9/00 ,  H05K1/0216 ,  H05K2201/10371

摘要： An example electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

公开(公告)号：US20240287373A1

公开(公告)日：2024-08-29

申请号：US18587698

申请日：2024-02-26

申请人： TAIYO HOLDINGS CO., LTD.

发明人： Yoshikazu DAIGO

IPC分类号： C09K5/14 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  H05K1/03

CPC分类号： C09K5/14 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  H05K1/0373 ,  C08K2201/001 ,  H05K2201/0209

摘要： Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness. In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thermal conductivity of a cured product of the thermosetting resin composition is adjusted to 2.5 W/m·K or more.

公开(公告)号：US12071583B2

公开(公告)日：2024-08-27

申请号：US16910652

申请日：2020-06-24

申请人： U.S. Army Combat Capabilities Development Command, Army Research Laboratory

发明人： Darin J. Sharar ,  Ronald Warzoha ,  Brian Donovan

IPC分类号： C09K5/14 ,  C09K5/06 ,  F28D20/02

CPC分类号： C09K5/14 ,  C09K5/063 ,  F28D20/02

摘要： A heat exchange component includes a part configured for exchanging thermal energy, the part is formed of at least one solid state Martensitic transformation phase change material which is configured to readily undergo a solid-solid martensitic transformation from one crystalline structure to another different crystalline structure during a change in temperature in the normal and/or anticipated operating temperatures of the heat exchange component. In some embodiments, the system further includes a temporally-evolving external temperature/heat source which changes the temperature and resultant phase of the solid-state phase change material. The temporally-evolving external temperature/heat source may involve a solid conducting material or electronic/photonic component, a fluid, a plasma, and/or a radiation source. The heat exchange component may be configured as a flat plate, tube, finned structure, porous structure, graded structure, cold plate, heat exchanger, condenser, evaporator, or any component generally regarded as a thermal energy storage or heat transfer structure in various embodiments.

公开(公告)号：US20240279523A1

公开(公告)日：2024-08-22

申请号：US18108460

申请日：2023-02-10

申请人： Westlake Epoxy Inc.

发明人： Christoph SCHEUER ,  Gabriele BADINI ,  Alexander LINZNER ,  Thomas DRESSEN

IPC分类号： C09K5/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/34 ,  C08L63/00 ,  H05K7/20

CPC分类号： C09K5/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/34 ,  C08L63/00 ,  H05K7/2039 ,  B32B2307/302 ,  C08K2003/343 ,  C08K2201/001

摘要： Embodiments of the present disclosure generally relate to epoxy resin compositions, methods of making epoxy resin compositions, and to uses of epoxy resin compositions. In an embodiment, the composition includes an epoxy resin, a latent catalytic curing agent, and a filler. The composition can be used in an article. In an embodiment, an article includes a heat-generating member, and a composition disposed on the heat-generating member, the composition comprising: an epoxy resin, a latent catalytic curing agent, and a filler.

公开(公告)号：US12060517B2

公开(公告)日：2024-08-13

申请号：US17607133

申请日：2020-04-06

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Shota Akiba

IPC分类号： H01L23/00 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/04 ,  C08K3/08 ,  C09K5/14 ,  H01L23/367 ,  H01L23/373

CPC分类号： C09K5/14 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/04 ,  C08K3/08 ,  H01L23/367 ,  H01L23/3737 ,  H01L24/29 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C08K2201/014 ,  C08K2201/016 ,  H01L2224/29191

摘要： A thermal conductive silicone composition contains, in specific amounts, each of (A) an organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to a silicon atom in one molecule, (C) a catalyst for hydrosilylation reaction, (D) a silver powder with a tapped density of 3.0 g/cm3 or higher, a specific surface area of 2.0 m2/g or less, and an aspect ratio of 1 to 30, and (E) a natural graphite powder or a synthetic graphite powder with an average particle size of 3 μm to 50 μm. This provides: a thermal conductive silicone composition that gives a cured material having a favorable heat-dissipating property; a semiconductor device using the cured material of the composition; and a method for manufacturing the same.

公开(公告)号：US20240258604A1

公开(公告)日：2024-08-01

申请号：US18563688

申请日：2022-05-27

申请人： Illinois Tool Works Inc.

发明人： Fanliang MENG

IPC分类号： H01M10/653 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38 ,  C08K5/06 ,  C08K7/00 ,  C08K13/04 ,  C09K5/14 ,  H01M50/383

CPC分类号： H01M10/653 ,  C08J5/18 ,  C08K13/04 ,  C09K5/14 ,  H01M50/383 ,  C08J2323/12 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K5/06 ,  C08K7/00 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/012 ,  C08K2201/014

摘要： The present application discloses a thermally conductive, electrically insulating film comprising: a thermoplastic resin accounting for 15-50% of the weight of the thermally conductive, electrically insulating film, and a thermally conductive filler accounting for 40-70% of the weight of the thermally conductive, electrically insulating film; wherein the thermally conductive filler comprises: a thermally conductive carbon-based filler, a thermally conductive metal oxide or hydroxide filler and a thermally conductive ceramic filler. The thermally conductive, electrically insulating film is used in electronic products or devices to not only impart excellent heat dissipation capability to electronic products and devices, but also meet the insulativity requirement for electronic products and devices. Meanwhile, such a thermally conductive, electrically insulating film further features excellent flame retardancy and mechanical properties to meet the requirements of the operating environment.

公开(公告)号：US20240230252A1

公开(公告)日：2024-07-11

申请号：US18563626

申请日：2021-05-26

申请人： NISSAN MOTOR CO., LTD.

发明人： Tetsuro NAITO ,  Yoshiko TSUKADA ,  Takako KANEKO ,  Atsuhiko YAJIMA ,  Kazuyuki SHIRATORI

IPC分类号： F28F21/02 ,  C08J5/18 ,  C08K3/04 ,  C08K7/00 ,  C09K5/14 ,  H01L33/64 ,  H05K7/20

CPC分类号： F28F21/02 ,  C08J5/18 ,  C09K5/14 ,  H01L33/641 ,  H01L33/644 ,  H05K7/2039 ,  C08J2309/06 ,  C08K3/042 ,  C08K7/00

摘要： Provided is a means capable of selectively improving thermal conductivity in a surface direction of a heat conduction sheet.
A heat conduction film is configured by disposing a scale-like carbon material formed of a plurality of graphene layers and a binder such that adjacent scale-like carbon materials are in contact with each other and a long axis of the scale-like carbon material is oriented in plane direction of the film, and further making at least a part of a minor diameter of the binder or a minor diameter of a void formed by the scale-like carbon material and the binder smaller than a minor diameter of the scale-like carbon material.

公开(公告)号：US20240228854A1

公开(公告)日：2024-07-11

申请号：US18180609

申请日：2023-03-08

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Hsiang-Yen TSAO ,  Hui-Wen CHANG ,  Jyh-Long JENG

IPC分类号： C09K5/14 ,  C08G59/02 ,  C08G69/40

CPC分类号： C09K5/14 ,  C08G59/02 ,  C08G69/40

摘要： A polymer is formed by reacting (a) benzaldazine compound with (b1) diamine compound, (b2) dianhydride compound, (b3) epoxy resin, or a combination thereof, wherein (a) benzaldazine compound has a chemical structure of




in which R1 is —NH2, —OH, or




The polymer can be combined with inorganic powder to form a thermal interface material.