- 专利标题: Package integrated synthetic jet device
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申请号: US15384158申请日: 2016-12-19
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公开(公告)号: US10121730B2公开(公告)日: 2018-11-06
- 发明人: Feras Eid , Jessica Gullbrand , Melissa A. Cowan
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt P.C.
- 主分类号: H01L23/467
- IPC分类号: H01L23/467 ; H05K7/20 ; H05K1/02 ; H05K1/18
摘要:
Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.
公开/授权文献
- US20170098593A1 PACKAGE INTEGRATED SYNTHETIC JET DEVICE 公开/授权日:2017-04-06
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