Invention Grant
- Patent Title: Package integrated synthetic jet device
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Application No.: US15384222Application Date: 2016-12-19
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Publication No.: US10134656B2Publication Date: 2018-11-20
- Inventor: Feras Eid , Jessica Gullbrand , Melissa A. Cowan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/467
- IPC: H01L23/467 ; H05K7/20 ; B81C1/00 ; H01L21/48 ; H01L21/683 ; H01L23/498 ; H05K1/02

Abstract:
Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.
Public/Granted literature
- US20170098594A1 PACKAGE INTEGRATED SYNTHETIC JET DEVICE Public/Granted day:2017-04-06
Information query
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