Invention Grant
- Patent Title: Loudspeaker module
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Application No.: US15524135Application Date: 2015-11-18
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Publication No.: US10149062B2Publication Date: 2018-12-04
- Inventor: Zhibing Zhang , Gang Chen
- Applicant: Goertek Inc
- Applicant Address: CN Weifang, Shandong
- Assignee: Goertek Inc
- Current Assignee: Goertek Inc
- Current Assignee Address: CN Weifang, Shandong
- Agency: Maine Cernota & Rardin
- Priority: CN201510149270 20150331
- International Application: PCT/CN2015/094884 WO 20151118
- International Announcement: WO2016/155326 WO 20161006
- Main IPC: H04R9/06
- IPC: H04R9/06 ; H04R1/06 ; H04R9/02 ; H04R1/02 ; H04R9/04

Abstract:
The present invention disclosed a loudspeaker module, comprising an inner cavity enclosed by a shell, a voice coil and an FPCB installed in the inner cavity, leading wires of the voice coil and a flexible connection part between the leading wires and the FPCB, wherein one end of the flexible connection part is connected with a free end of the leading wires, and the other end thereof is connected with the FPCB; and the flexible connection part is suspended in the inner cavity through the leading wires and the FPCB. In the loudspeaker module of this invention, the leading wires can be vibrated with the flexible connection part, thereby effectively preventing the leading wires from falling and fracturing at the connection position, improving the reliability of the loudspeaker module, and simultaneously avoiding the large space demand and resonance caused by elongated leading wires.
Public/Granted literature
- US20180176690A1 LOUDSPEAKER MODULE Public/Granted day:2018-06-21
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