- 专利标题： Polyimide-based polymer thick film resistor composition
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申请号： US15380210申请日： 2016-12-15
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公开(公告)号： US10153075B2公开(公告)日： 2018-12-11
- 发明人: Seigi Suh
- 申请人： E I DU PONT DE NEMOURS AND COMPANY
- 申请人地址： US DE Wilmington
- 专利权人： E I DU PONT DE NEMOURS AND COMPANY
- 当前专利权人： E I DU PONT DE NEMOURS AND COMPANY
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01B1/24
- IPC分类号： H01B1/24 ; C09D5/24 ; H01C17/065 ; C08K3/04 ; C08K3/08 ; H01C7/00
摘要：
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
公开/授权文献
- US20170200539A1 POLYIMIDE-BASED POLYMER THICK FILM RESISTOR COMPOSITION 公开/授权日：2017-07-13
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