-
公开(公告)号：US09637647B2
公开(公告)日：2017-05-02
申请号：US14862254
申请日：2015-09-23
发明人： Seigi Suh
CPC分类号： C09D5/24 , B05D5/12 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08K2003/085 , C09D179/08 , H01B1/22 , H05K1/095 , H05K3/102 , H05K2201/0154 , H05K2201/0245 , H05K2203/1157 , C08K3/08
摘要： This invention provides a polymer thick film copper conductor composition for forming an electrical conductor and a method for using the polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
-
公开(公告)号：US10189950B2
公开(公告)日：2019-01-29
申请号：US15375544
申请日：2016-12-12
发明人： Seigi Suh , Haixin Yang
IPC分类号： C09D11/00 , C08G73/10 , C08K3/04 , C08K3/08 , C08K3/38 , H05K3/00 , C09D11/033 , C09D11/037 , C09D11/102 , C09D11/52 , C09D179/08 , H05K1/00
摘要： This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit.
-
公开(公告)号：US09649730B2
公开(公告)日：2017-05-16
申请号：US14824202
申请日：2015-08-12
发明人： Seigi Suh
CPC分类号： B23K35/3006 , B23K35/025 , B23K35/3612 , B23K35/3613 , C09D5/24 , H01B1/22 , H05K1/095 , H05K2201/0154 , H05K2201/0245
摘要： The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380° C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition.
-
公开(公告)号：US20190100676A1
公开(公告)日：2019-04-04
申请号：US16207801
申请日：2018-12-03
发明人： Seigi Suh
IPC分类号： C09D179/08 , H01C7/00 , C09D5/24
摘要： The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
-
公开(公告)号：US10153075B2
公开(公告)日：2018-12-11
申请号：US15380210
申请日：2016-12-15
发明人： Seigi Suh
摘要： The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
-
公开(公告)号：US20170200539A1
公开(公告)日：2017-07-13
申请号：US15380210
申请日：2016-12-15
发明人： Seigi Suh
CPC分类号： H01C17/0652 , C08K3/04 , C08K3/08 , C08K2003/0806 , C08K2201/001 , C09D5/24 , H01B1/24 , H01C7/005
摘要： The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
-
公开(公告)号：US20170174838A1
公开(公告)日：2017-06-22
申请号：US15375544
申请日：2016-12-12
发明人： Seigi Suh , Haixin Yang
CPC分类号： C08G73/1067 , C08G73/1071 , C08K3/04 , C08K3/08 , C08K3/38 , C08K2003/0806 , C08K2003/385 , C09D11/00 , C09D11/033 , C09D11/037 , C09D11/102 , C09D11/52 , C09D179/08 , H05K1/00 , H05K3/00
摘要： This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit
-
公开(公告)号：US20170044383A1
公开(公告)日：2017-02-16
申请号：US14862254
申请日：2015-09-23
发明人： Seigi Suh
CPC分类号： C09D5/24 , B05D5/12 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08K2003/085 , C09D179/08 , H01B1/22 , H05K1/095 , H05K3/102 , H05K2201/0154 , H05K2201/0245 , H05K2203/1157 , C08K3/08
摘要： This invention provides a polymer thick film copper conductor composition for forming an electrical conductor and a method for using the polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
摘要翻译： 本发明提供一种用于形成电导体的聚合物厚膜铜导体组合物和使用聚合物厚膜铜导体组合物在电路中形成电导体的方法。 该方法使沉积的厚膜铜导体组合物进行光子烧结。 本发明还提供了包含由聚合物厚膜铜导体组合物制成的电导体以及由该方法形成的电导体的电气装置。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.019 秒)
