- 专利标题: Curing apparatus and method using the same
-
申请号: US15803680申请日: 2017-11-03
-
公开(公告)号: US10157759B2公开(公告)日: 2018-12-18
- 发明人: Hsueh-Kuang Ni , Chi-Jen Chen , Peng-Cheng Hong
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Maschoff Brennan
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/67 ; B05D3/06 ; C23C16/44 ; C23C16/56 ; B05D1/00
摘要:
A UV curing apparatus includes a processing chamber, a UV light source disposed above the processing chamber, a window disposed between the processing chamber and the UV light source for allowing a UV light from the UV light source passing through and entering the processing chamber, a sealing ring disposed between the processing chamber and the window for sealing the processing chamber, and a light shading kit disposed between the UV light source and the sealing ring for preventing the sealing ring from being exposed of the UV light. Therefore the sealing ring is not exposed of UV light directly, and the bonding of the rubber sealing ring would not be destroyed.
公开/授权文献
- US20180061685A1 CURING APPARATUS AND METHOD USING THE SAME 公开/授权日:2018-03-01
信息查询
IPC分类: