Invention Grant
- Patent Title: Circular support substrate for semiconductor
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Application No.: US15529070Application Date: 2015-11-24
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Publication No.: US10163674B2Publication Date: 2018-12-25
- Inventor: Shiro Hara , Sommawan Khumpuang , Fumito Imura , Michihiro Inoue , Arami Saruwatari
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Applicant Address: JP Tokyo
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2014-239966 20141127
- International Application: PCT/JP2015/082845 WO 20151124
- International Announcement: WO2016/084767 WO 20160602
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/683 ; H01L21/02 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.
Public/Granted literature
- US20170352570A1 CIRCULAR SUPPORT SUBSTRATE FOR SEMICONDUCTOR Public/Granted day:2017-12-07
Information query
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