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公开(公告)号：US10163819B2
公开(公告)日：2018-12-25
申请号：US15529072
申请日：2015-11-24
Inventor： Shiro Hara , Sommawan Khumpuang , Fumito Imura , Michihiro Inoue , Arami Saruwatari
IPC: H01L23/00 , H01L23/12 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/538 , H01L23/29
Abstract: A method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is characterized by including at least the following steps in this order: a first step in which a semiconductor chip is bonded onto a circular support substrate; a second step in which the semiconductor chip is sealed with resin; a third step in which the resin covering the pads of the semiconductor chip is removed; a fourth step in which a rewiring layer is formed; and a fifth step in which bumps are formed. The method can provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress.
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公开(公告)号：US11056410B2
公开(公告)日：2021-07-06
申请号：US16497283
申请日：2018-03-28
Inventor： Shiro Hara , Sommawan Khumpuang , Fumito Imura
IPC: H01L23/12 , H01L21/56 , H01L21/677 , H01L23/544
Abstract: A method of manufacturing a semiconductor package and a semiconductor package in which positional alignment between a wafer and a substrate until the wafer is mounted and packaged on the substrate is achieved accurately. A wafer is mounted on a package substrate by using first alignment marks and D-cuts as benchmarks, and then a mold resin layer is formed on the wafer in a state in which the first alignment mark is exposed. A part of the mold resin layer is removed by using the D-cuts exposed from the mold resin layer as benchmarks, so that the first alignment marks can be visually recognized. A second alignment marks are formed on the mold resin layer by using the first alignment marks as benchmarks. A Cu redistribution layer to be conducted to a pad portion is formed on a mold resin layer by using the second alignment marks as benchmarks.
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公开(公告)号：US10304675B2
公开(公告)日：2019-05-28
申请号：US15531237
申请日：2015-11-16
Inventor： Michihiro Inoue , Shiro Hara , Fumito Imura , Arami Saruwatari , Sommawan Khumpuang
IPC: H01L21/677 , H01L21/673 , H01L21/02 , H01L23/00 , H01L23/544
Abstract: A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.
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公开(公告)号：US10163674B2
公开(公告)日：2018-12-25
申请号：US15529070
申请日：2015-11-24
Inventor： Shiro Hara , Sommawan Khumpuang , Fumito Imura , Michihiro Inoue , Arami Saruwatari
IPC: H01L23/544 , H01L21/683 , H01L21/02 , H01L21/56 , H01L23/31 , H01L23/00
Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.
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