Invention Grant
- Patent Title: Integrated circuit device and method of manufacturing same
-
Application No.: US13409999Application Date: 2012-03-01
-
Publication No.: US10163724B2Publication Date: 2018-12-25
- Inventor: Pai-Chieh Wang , Yimin Huang
- Applicant: Pai-Chieh Wang , Yimin Huang
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
An integrated circuit device and method for manufacturing the integrated circuit device is disclosed. The disclosed method provides improved protection for the bottom portion of the gate structure. In some embodiments, the method achieves improved protection for gate structure bottom by forming a recess on either side of the gate structure and placing spacers on the side walls of the gate structure, so that the spacers protect the portion of the gate structure below the gate dielectric layer.
Public/Granted literature
- US20130230952A1 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2013-09-05
Information query
IPC分类: