发明授权
- 专利标题： CMP pad conditioner
-
申请号： US14233489申请日： 2012-07-16
-
公开(公告)号： US10166653B2公开(公告)日： 2019-01-01
- 发明人: Seh Kwang Lee , Joo Han Lee
- 申请人： Seh Kwang Lee , Joo Han Lee
- 申请人地址： KR Gyeonggi-Do
- 专利权人： EHWA DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人： EHWA DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： The PL Law Group, PLLC
- 优先权： KR10-2011-0070924 20110718; KR10-2012-0066596 20120621
- 国际申请： PCT/KR2012/005649 WO 20120716
- 国际公布： WO2013/012226 WO 20130124
- 主分类号： B24B53/017
- IPC分类号： B24B53/017 ; B24B53/12
摘要：
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
公开/授权文献
- US20140154960A1 CMP PAD CONDITIONER 公开/授权日：2014-06-05