Invention Grant
- Patent Title: Attaching chip attach medium to already encapsulated electronic chip
-
Application No.: US15422674Application Date: 2017-02-02
-
Publication No.: US10177112B2Publication Date: 2019-01-08
- Inventor: Joachim Mahler , Edward Fuergut , Georg Meyer-Berg
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016101887 20160203
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/31 ; H01L23/498
Abstract:
A method of manufacturing a package which comprises encapsulating at least part of an electronic chip by an encapsulant, subsequently covering a part of the electronic chip with a chip attach medium, and attaching the encapsulated electronic chip on a chip carrier via the chip attach medium.
Public/Granted literature
- US20170221857A1 Attaching chip attach medium to already encapsulated electronic chip Public/Granted day:2017-08-03
Information query
IPC分类:
