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1.发明授权公开(公告)号：US12033972B2
公开(公告)日：2024-07-09
申请号：US17090941
申请日：2020-11-06
发明人： Joachim Mahler , Michael Bauer , Jochen Dangelmaier , Reimund Engl , Johann Gatterbauer , Frank Hille , Michael Huettinger , Werner Kanert , Heinrich Koerner , Brigitte Ruehle , Francisco Javier Santos Rodriguez , Antonio Vellei
IPC分类号： H01L23/00 , H01L21/02 , H01L23/29 , H01L23/31 , H01L23/495
CPC分类号： H01L24/48 , H01L21/02164 , H01L21/0217 , H01L21/02288 , H01L23/293 , H01L23/3135 , H01L23/3142 , H01L23/4952 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/83 , H01L24/85 , H01L21/02266 , H01L21/02271 , H01L21/02274 , H01L21/0228 , H01L23/3107 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/0346 , H01L2224/03826 , H01L2224/03827 , H01L2224/03831 , H01L2224/04042 , H01L2224/05073 , H01L2224/05139 , H01L2224/05147 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/05664 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/2919 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45573 , H01L2224/45611 , H01L2224/45618 , H01L2224/45639 , H01L2224/45644 , H01L2224/45649 , H01L2224/45655 , H01L2224/45657 , H01L2224/45664 , H01L2224/45666 , H01L2224/4567 , H01L2224/45671 , H01L2224/45672 , H01L2224/4568 , H01L2224/45686 , H01L2224/4569 , H01L2224/45693 , H01L2224/48091 , H01L2224/48106 , H01L2224/4813 , H01L2224/48247 , H01L2224/4846 , H01L2224/48463 , H01L2224/48465 , H01L2224/4847 , H01L2224/48507 , H01L2224/73265 , H01L2224/85205 , H01L2224/85375 , H01L2224/85801 , H01L2224/8592 , H01L2924/00014 , H01L2924/0132 , H01L2924/10253 , H01L2924/181 , H01L2924/181 , H01L2924/00012 , H01L2224/48091 , H01L2924/00014 , H01L2224/73265 , H01L2224/32245 , H01L2224/48247 , H01L2924/00012 , H01L2224/48465 , H01L2224/48247 , H01L2924/00012 , H01L2224/45144 , H01L2924/00015 , H01L2224/45139 , H01L2924/00015 , H01L2224/45565 , H01L2224/45147 , H01L2224/45664 , H01L2224/45572 , H01L2224/45147 , H01L2224/45664 , H01L2224/45644 , H01L2224/45147 , H01L2924/01046 , H01L2224/45639 , H01L2924/00014 , H01L2224/85205 , H01L2924/00014 , H01L2224/05644 , H01L2924/00014 , H01L2224/05639 , H01L2924/00014 , H01L2224/05664 , H01L2924/00014 , H01L2224/45565 , H01L2224/45147 , H01L2224/45669 , H01L2224/45565 , H01L2224/45147 , H01L2224/45644 , H01L2224/45565 , H01L2224/45139 , H01L2224/45565 , H01L2224/45147 , H01L2224/45611 , H01L2224/45565 , H01L2224/45147 , H01L2224/45618 , H01L2224/45565 , H01L2224/45147 , H01L2224/45649 , H01L2224/45565 , H01L2224/45147 , H01L2224/45655 , H01L2224/45565 , H01L2224/45147 , H01L2224/45657 , H01L2224/45565 , H01L2224/45147 , H01L2224/45666 , H01L2224/45655 , H01L2924/01029 , H01L2224/45565 , H01L2224/45147 , H01L2224/45639 , H01L2224/45664 , H01L2924/01028 , H01L2224/05624 , H01L2924/00014 , H01L2224/05655 , H01L2924/00014 , H01L2224/05681 , H01L2924/00014 , H01L2224/05657 , H01L2924/00014 , H01L2224/05666 , H01L2924/00014 , H01L2224/05684 , H01L2924/00014 , H01L2224/05147 , H01L2924/01056 , H01L2224/48465 , H01L2224/48247 , H01L2924/00 , H01L2924/181 , H01L2924/00014 , H01L2224/2919 , H01L2924/00014 , H01L2924/00014 , H01L2224/43848
摘要： A method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.
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2.发明授权公开(公告)号：US11682644B2
公开(公告)日：2023-06-20
申请号：US17361950
申请日：2021-06-29
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/11822 , H01L2224/1357 , H01L2224/1362 , H01L2224/13082 , H01L2224/13111 , H01L2224/13611 , H01L2224/13613 , H01L2224/13618 , H01L2224/13638 , H01L2224/13639 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/81801
摘要： A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition.
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公开(公告)号：US10854547B2
公开(公告)日：2020-12-01
申请号：US16279370
申请日：2019-02-19
发明人： Joachim Mahler , Georg Meyer-Berg , Guenter Tutsch
IPC分类号： H01L23/532 , H01L23/31 , H01L23/495 , H01L21/56 , H01L25/07 , H01L23/00
摘要： A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.
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公开(公告)号：US10396007B2
公开(公告)日：2019-08-27
申请号：US15448018
申请日：2017-03-02
发明人： Sook Woon Chan , Chau Fatt Chiang , Kok Yau Chua , Soon Lock Goh , Swee Kah Lee , Joachim Mahler , Mei Chin Ng , Beng Keh See , Guan Choon Matthew Nelson Tee
IPC分类号： H01L23/552 , H01L23/31 , C09D5/00 , C09D201/00 , C23C18/16 , C23C18/18 , C23C18/34 , H01L21/56 , H01L23/29 , H01L23/66 , H01L23/00 , C09D5/24
摘要： A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.
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公开(公告)号：US20190109112A1
公开(公告)日：2019-04-11
申请号：US15725796
申请日：2017-10-05
发明人： Joachim Mahler , Georg Meyer-Berg
摘要： A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.
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公开(公告)号：US20180338379A1
公开(公告)日：2018-11-22
申请号：US15982778
申请日：2018-05-17
发明人： Thomas Bemmerl , Joachim Mahler
摘要： An electronic device includes a component, an electronic component, and a joining material arranged between a surface of the component and a surface of the electronic component. Spacer elements are embedded in the joining material. Interconnects are arranged between the spacer elements and the surface of the component, and between the spacer elements and the surface of the electronic component.
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7.发明授权公开(公告)号：US10038105B2
公开(公告)日：2018-07-31
申请号：US15229828
申请日：2016-08-05
IPC分类号： H01L29/861 , H01L29/08 , H01L29/36 , H01L29/45 , H01L29/47 , H01L29/872 , H01L29/06 , H01L29/16
CPC分类号： H01L29/861 , H01L29/0619 , H01L29/08 , H01L29/1608 , H01L29/36 , H01L29/456 , H01L29/47 , H01L29/7393 , H01L29/872
摘要： A semiconductor device includes at least one highly doped region of an electrical device arrangement formed in a semiconductor substrate and a contact structure including an NTC (negative temperature coefficient of resistance) portion arranged adjacent to the at least one highly doped region at a front side surface of the semiconductor substrate. The NTC portion includes a negative temperature coefficient of resistance material.
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公开(公告)号：US10020245B2
公开(公告)日：2018-07-10
申请号：US14150795
申请日：2014-01-09
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
IPC分类号： H01L23/48 , H01L23/538 , H01L23/00 , H01L25/065 , H01L25/18 , H05K1/18 , H01L21/56 , H01L21/683 , H01L23/31 , H05K1/05 , H05K3/46
CPC分类号： H01L23/481 , H01L21/56 , H01L21/6835 , H01L23/3107 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/18 , H01L2221/68372 , H01L2221/68377 , H01L2224/0557 , H01L2224/24137 , H01L2224/2518 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15192 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K1/05 , H05K1/185 , H05K1/188 , H05K3/4644 , H05K2201/09745 , H05K2201/09972 , H05K2203/0353 , H05K2203/1469 , H01L2924/00 , H01L2224/05552
摘要： A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.
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公开(公告)号：US09984897B2
公开(公告)日：2018-05-29
申请号：US15268674
申请日：2016-09-19
IPC分类号： H01L21/48 , H01L23/373 , H01L21/77 , H01L23/495 , H01L23/00 , H01L21/56 , H01L25/00
CPC分类号： H01L21/4807 , H01L21/4825 , H01L21/56 , H01L21/77 , H01L23/3731 , H01L23/3735 , H01L23/49562 , H01L23/49575 , H01L23/49586 , H01L24/27 , H01L24/743 , H01L25/50 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/49111 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/07802 , H01L2924/12032 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.
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公开(公告)号：US09852918B2
公开(公告)日：2017-12-26
申请号：US14835750
申请日：2015-08-26
发明人： Peh Hean Teh , Jagen Krishnan , Swee Kah Lee , Poh Cheng Lim , Joachim Mahler , Chew Theng Tai , Yik Yee Tan , Soon Lock Goh
IPC分类号： H01L23/29 , H01L21/3105 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/495 , C09J163/00
CPC分类号： H01L21/3105 , C09J163/00 , H01L21/56 , H01L23/295 , H01L23/3107 , H01L23/3142 , H01L23/49513 , H01L23/49548 , H01L23/49555 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8392 , H01L2224/8592 , H01L2224/92247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
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