Provided herein are improved electrical circuit protection devices for protection against electrostatic discharge (ESD), the devices including a first support substrate, a first electrode and a second electrode formed on the first support substrate, wherein the first electrode and the second electrode are formed from a conductive material. The devices further include a first bonding pad disposed on the first and second electrode, the first bonding pad having a first cavity formed therein; a second support substrate disposed on the first bonding pad, the second support substrate having a second cavity formed therein, and a voltage variable material disposed within the first cavity and the second cavity and electrically connected to the first electrode and the second electrode. The devices further include a second bonding pad disposed on the second support substrate, and a third support substrate disposed on the second bonding pad.