公开(公告)号：US10181718B2

公开(公告)日：2019-01-15

申请号：US14995881

申请日：2016-01-14

Applicant: LITTELFUSE, INC.

Inventor： Conrado De Leon ,  Albert Enriquez ,  Editha Liquido ,  Crispin Zulueta

IPC: H02H9/04 ,  H02H9/00 ,  H02K1/02 ,  H05K1/02 ,  H05K1/03

Abstract: Provided herein are improved electrical circuit protection devices for protection against electrostatic discharge (ESD), the devices including a first support substrate, a first electrode and a second electrode formed on the first support substrate, wherein the first electrode and the second electrode are formed from a conductive material. The devices further include a first bonding pad disposed on the first and second electrode, the first bonding pad having a first cavity formed therein; a second support substrate disposed on the first bonding pad, the second support substrate having a second cavity formed therein, and a voltage variable material disposed within the first cavity and the second cavity and electrically connected to the first electrode and the second electrode. The devices further include a second bonding pad disposed on the second support substrate, and a third support substrate disposed on the second bonding pad.

公开(公告)号：US20160218502A1

公开(公告)日：2016-07-28

申请号：US14995881

申请日：2016-01-14

Applicant: LITTELFUSE, INC.

Inventor： Conrado De Leon ,  Albert Enriquez ,  Editha Liquido ,  Crispin Zulueta

IPC: H02H9/04 ,  H05K1/11 ,  H05K1/03 ,  H02H9/00

CPC classification number: H02H9/04 ,  H02H9/005 ,  H05K1/0259 ,  H05K1/0306 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0738

Abstract: Provided herein are improved electrical circuit protection devices for protection against electrostatic discharge (ESD), the devices including a first support substrate, a first electrode and a second electrode formed on the first support substrate, wherein the first electrode and the second electrode are formed from a conductive material. The devices further include a first bonding pad disposed on the first and second electrode, the first bonding pad having a first cavity formed therein; a second support substrate disposed on the first bonding pad, the second support substrate having a second cavity formed therein, and a voltage variable material disposed within the first cavity and the second cavity and electrically connected to the first electrode and the second electrode. The devices further include a second bonding pad disposed on the second support substrate, and a third support substrate disposed on the second bonding pad.

Abstract translation: 本文提供了用于防止静电放电（ESD）的改进的电路保护装置，所述装置包括形成在第一支撑衬底上的第一支撑衬底，第一电极和第二电极，其中第一电极和第二电极由 导电材料。 所述器件还包括设置在所述第一和第二电极上的第一焊盘，所述第一接合焊盘具有形成在其中的第一腔; 设置在所述第一焊盘上的第二支撑基板，所述第二支撑基板具有形成在其中的第二空腔，以及设置在所述第一空腔和所述第二空腔内且电连接到所述第一电极和所述第二电极的电压可变材料。 所述装置还包括设置在所述第二支撑基板上的第二接合焊盘和设置在所述第二接合焊盘上的第三支撑基板。