- 专利标题： Method of punching out a damper from a damper material having a constraint layer, punching apparatus used for the method, and attaching apparatus with the punching apparatus
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申请号： US14154388申请日： 2014-01-14
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公开(公告)号： US10183414B2公开(公告)日： 2019-01-22
- 发明人: Akio Mashima
- 申请人： NHK Spring Co., Ltd.
- 申请人地址： JP Kanagawa
- 专利权人： NHK Spring Co., Ltd.
- 当前专利权人： NHK Spring Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 代理机构： Norris McLaughlin, P.A.
- 优先权： JP2013-022654 20130207
- 主分类号： B26F1/14
- IPC分类号： B26F1/14 ; B26D7/08 ; B26D7/18 ; B26F1/02 ; B26F1/38 ; G11B5/48 ; B26F1/00
摘要：
A method punches out a damper from a damper material set on a punching stage with use of a hollow punch so that the punched damper is positioned within a hollow inside of the punch while vibrating a member composing the punching stage on which the damper material is set at the high frequency. The damper material includes a viscoelastic body layer and the constraint layer laminated on the viscoelastic body layer and the viscoelastic body layer includes an attaching surface through which the damper material is detachably attached on the liner.
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