Invention Grant
- Patent Title: Heat pipe
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Application No.: US15586419Application Date: 2017-05-04
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Publication No.: US10184729B2Publication Date: 2019-01-22
- Inventor: Yoshikatsu Inagaki , Kenya Kawabata , Tatsuro Miura , Tomoki Yanagida
- Applicant: Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2014-232381 20141117
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28F1/08 ; F28D15/02 ; F28D21/00

Abstract:
A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.
Public/Granted literature
- US20170234625A1 Heat Pipe Public/Granted day:2017-08-17
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