- 专利标题： Lift pin for substrate processing
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申请号： US13833616申请日： 2013-03-15
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公开(公告)号： US10195704B2公开(公告)日： 2019-02-05
- 发明人: Christian Himmelsbach , Joachim Hirschler , Helmut Brunner
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater Matsil, LLP
- 主分类号： B23Q7/00
- IPC分类号： B23Q7/00 ; H01L21/687
摘要：
Lift pins and devices having lift pins are provided. According to an aspect, a lift pin may have a tapered distal portion. According to another aspect, a lift pin may have two portions threadedly engaged with each other. According to yet another aspect, a lift pin may be mounted to a lifting plate with slackness.
公开/授权文献
- US20140265098A1 Lift Pin for Substrate Processing 公开/授权日：2014-09-18
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