Invention Grant
- Patent Title: Wafer placement and gap control optimization through in situ feedback
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Application No.: US14471884Application Date: 2014-08-28
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Publication No.: US10196741B2Publication Date: 2019-02-05
- Inventor: Kevin Griffin , Abraham Ravid , Alex Minkovich , Somesh Khandelwal , Joseph Yudovsky , Todd Egan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: B05C1/08
- IPC: B05C1/08 ; B05C11/10 ; C23C16/458 ; C23C16/455 ; C23C16/52 ; G01D5/24
Abstract:
Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.
Public/Granted literature
- US20150376782A1 Wafer Placement And Gap Control Optimization Through In Situ Feedback Public/Granted day:2015-12-31
Information query
