公开(公告)号：US11927535B2

公开(公告)日：2024-03-12

申请号：US18129503

申请日：2023-03-31

申请人： Applied Materials, Inc.

发明人： Avishek Ghosh ,  Byung-Sung Kwak ,  Todd Egan ,  Robert Jan Visser ,  Gangadhar Banappanavar ,  Dinesh Kabra

IPC分类号： G01N23/00 ,  G01N21/64 ,  H10K50/10

CPC分类号： G01N21/6489 ,  G01N21/6408 ,  H10K50/182

摘要： An apparatus for determining a characteristic of a photoluminescent (PL) layer comprises: a light source that generates an excitation light that includes light from the visible or near-visible spectrum; an optical assembly configured to direct the excitation light onto a PL layer; a detector that is configured to receive a PL emission generated by the PL layer in response to the excitation light interacting with the PL layer and generate a signal based on the PL emission; and a computing device coupled to the detector and configured to receive the signal from the detector and determine a characteristic of the PL layer based on the signal.

公开(公告)号：US11908716B2

公开(公告)日：2024-02-20

申请号：US17321366

申请日：2021-05-14

申请人： Applied Materials, Inc.

发明人： Guoheng Zhao ,  Venkatakaushik Voleti ,  Todd Egan ,  Kyle R. Tantiwong ,  Andreas Schulze ,  Niranjan Ramchandra Khasgiwale ,  Mehdi Vaez-Iravani

IPC分类号： H01L21/67 ,  C23C16/52 ,  G01N21/55 ,  H01L21/66

CPC分类号： H01L21/67253 ,  C23C16/52 ,  G01N21/55 ,  H01L21/67069 ,  H01L22/12

摘要： Methods and systems for monitoring etch or deposition processes using image-based in-situ process monitoring techniques include illuminating a measurement area on a sample disposed in a process chamber. The measurement area is illuminated using an input beam generated remote from the process chamber and transmitted to a first viewing window of the process chamber by a first optical fiber. Portions of the first input beam reflected from the measurement area are transmitted from the first viewing window to an imaging sensor by a second optical fiber. A sequence of images is obtained at the imaging sensor, and a change in reflectance of pixels within each of the images is determined. The etch or deposition process is monitored based on the change in reflectance.

公开(公告)号：US11662317B2

公开(公告)日：2023-05-30

申请号：US17188485

申请日：2021-03-01

申请人： Applied Materials, Inc.

发明人： Avishek Ghosh ,  Byung-Sung Kwak ,  Todd Egan ,  Robert Jan Visser ,  Gangadhar Banappanavar ,  Dinesh Kabra

IPC分类号： G01N21/00 ,  G01N21/64 ,  H01L51/52

CPC分类号： G01N21/6489 ,  G01N21/6408 ,  H01L51/5287

摘要： An apparatus for determining a characteristic of a photoluminescent (PL) layer comprises: a light source that generates an excitation light that includes light from the visible or near-visible spectrum; an optical assembly configured to direct the excitation light onto a PL layer; a detector that is configured to receive a PL emission generated by the PL layer in response to the excitation light interacting with the PL layer and generate a signal based on the PL emission; and a computing device coupled to the detector and configured to receive the signal from the detector and determine a characteristic of the PL layer based on the signal.

公开(公告)号：US10217650B2

公开(公告)日：2019-02-26

申请号：US15264082

申请日：2016-09-13

申请人： APPLIED MATERIALS, INC.

发明人： James Matthew Holden ,  Song-Moon Suh ,  Todd Egan ,  Kalyanjit Ghosh ,  Leon Volfovski ,  Michael R. Rice ,  Richard Giljum

IPC分类号： B08B7/00 ,  H01L21/67 ,  H01L21/02 ,  B01D39/12 ,  B08B5/00

摘要： A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body.

公开(公告)号：US10112259B2

公开(公告)日：2018-10-30

申请号：US14684290

申请日：2015-04-10

申请人： APPLIED MATERIALS, INC.

发明人： James M. Holden ,  Nir Merry ,  Todd Egan

IPC分类号： B23K26/06 ,  B23K26/00 ,  B23K26/36 ,  H01L21/67 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/78 ,  B23K26/364 ,  B23K26/0622 ,  B23K26/40 ,  B23K103/16 ,  B23K103/00

摘要： Methods and apparatuses for dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating by a laser beam with a centrally peaked spatial power profile to form an ablated trench in the substrate below thin film device layers which is positively sloped. In an embodiment, a femtosecond laser forms a positively sloped ablation profile which facilitates vertically-oriented propagation of microcracks in the substrate at the ablated trench bottom. With minimal lateral runout of microcracks, a subsequent anisotropic plasma etch removes the microcracks for a cleanly singulated chip with good reliability.

公开(公告)号：US09620379B2

公开(公告)日：2017-04-11

申请号：US14775651

申请日：2014-03-11

申请人： APPLIED MATERIALS, INC.

发明人： Wei-Sheng Lei ,  Mohammad Kamruzzaman Chowdhury ,  Todd Egan ,  Brad Eaton ,  Madhava Rao Yalamanchili ,  Ajay Kumar

IPC分类号： H01L21/67 ,  H01L21/78 ,  H01L21/308 ,  H01L21/3065 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  H01L21/673 ,  H01L21/687 ,  H01L21/82 ,  B23K103/16 ,  B23K103/00

CPC分类号： H01L21/3086 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/3081 ,  H01L21/3085 ,  H01L21/67069 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67383 ,  H01L21/68707 ,  H01L21/78 ,  H01L21/82

摘要： Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a laser energy absorbing, non-photodefinable topcoat disposed over a water-soluble base layer disposed over the semiconductor substrate. Because the laser light absorbing material layer is non-photodefinable, material costs associated with conventional photo resist formulations may be avoided. The mask is direct-write patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. Absorption of the mask layer within the laser emission band (e.g., UV band and/or green band) promotes good scribe line quality. The substrate may then be plasma etched through the gaps in the patterned mask to singulate the IC with the mask protecting the ICs during the plasma etch. The soluble base layer of the mask may then be dissolved subsequent to singulation, facilitating removal of the layer.

公开(公告)号：US20160181134A1

公开(公告)日：2016-06-23

申请号：US14839656

申请日：2015-08-28

申请人： Applied Materials, Inc.

发明人： Edward W. Budiarto ,  Majeed A. Foad ,  Ralf Hofmann ,  Thomas Nowak ,  Todd Egan ,  Mehdi Vaez-Iravani

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/285 ,  H01L21/66 ,  H01L21/033

CPC分类号： H01L21/67253 ,  G03F1/22 ,  G03F1/24 ,  H01L21/02631 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/2855 ,  H01L22/12 ,  H01L22/26

摘要： A monitoring and deposition control system and method of operation thereof including: a deposition chamber for depositing a material layer on a substrate; a sensor array for monitoring deposition of the material layer for changes in a layer thickness of the material layer during deposition; and a processing unit for adjusting deposition parameters based on the changes in the layer thickness during deposition.

摘要翻译： 一种监测和沉积控制系统及其操作方法，包括：沉积室，用于在基板上沉积材料层; 传感器阵列，用于监测材料层的沉积，用于在沉积期间材料层的层厚度的变化; 以及用于基于沉积期间的层厚度的变化来调整沉积参数的处理单元。

公开(公告)号：US08969177B2

公开(公告)日：2015-03-03

申请号：US13917568

申请日：2013-06-13

申请人： Applied Materials, Inc.

发明人： Mohammad Kamruzzaman Chowdhury ,  Wei-Sheng Lei ,  Todd Egan ,  Brad Eaton ,  Madhava Rao Yalamanchili ,  Ajay Kumar

IPC分类号： H01L21/00 ,  H01L21/78 ,  B23K26/36 ,  H01L21/67 ,  B23K26/06 ,  B23K26/18 ,  B23K26/40

CPC分类号： H01L21/67155 ,  B23K26/0624 ,  B23K26/0661 ,  B23K26/18 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/67069 ,  H01L21/67115 ,  H01L21/67207 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68381

摘要： Laser and plasma etch wafer dicing using UV-curable adhesive films. A mask is formed covering ICs formed on the wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is coupled to a carrier substrate by a double-sided UV-curable adhesive film. The mask is patterned by laser scribing to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the ICs. The UV-curable adhesive film is partially cured by UV irradiation through the carrier. The singulated ICs are then detached from the partially cured adhesive film still attached to the carrier substrate, for example individually by a pick and place machine. The UV-curable adhesive film may then be further cured for the film's complete removal from the carrier substrate.

摘要翻译： 激光和等离子体蚀刻晶圆切割使用紫外光固化粘合膜。 形成覆盖在晶片上形成的IC的掩模，以及提供与IC的接口的任何凸块。 半导体晶片通过双面UV固化粘合剂膜耦合到载体基板。 通过激光划线将掩模图案化以提供具有间隙的图案化掩模。 图案化使得半导体晶片的区域在形成IC的薄膜层之下露出。 然后通过图案化掩模中的间隙蚀刻半导体晶片，以对IC进行单片化。 UV固化粘合剂膜通过载体的UV照射部分固化。 然后将分离的IC从仍然附着到载体基底上的部分固化的粘合剂膜分离，例如通过拾取和放置机单独分离。 然后可以进一步固化可UV固化的粘合剂膜，以使膜完全从载体基材上除去。

公开(公告)号：US20240071792A1

公开(公告)日：2024-02-29

申请号：US17895952

申请日：2022-08-25

申请人： Applied Materials, Inc.

发明人： Tapashree Roy ,  Todd Egan ,  Viswanath Bavigadda ,  Nitin Gupta

IPC分类号： H01L21/67 ,  G06K9/62 ,  G06N20/00 ,  H01L21/677

CPC分类号： H01L21/67253 ,  G06K9/6256 ,  G06N20/00 ,  H01L21/67742

摘要： A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the substrate processing system. The method further includes processing the first data to obtain second data. The second data includes a first indication of performance of the substrate processing system. The method further includes causing, in view of the second data, performance of a corrective actions associated with the substrate processing system.

公开(公告)号：US20220397515A1

公开(公告)日：2022-12-15

申请号：US17344788

申请日：2021-06-10

申请人： APPLIED MATERIALS, INC.

发明人： Pengyu Han ,  Lei Lian ,  Shu Yu Chen ,  Todd Egan ,  Wan Hsueh Lai ,  Chao-Hsien Lee ,  Pin Ham Lu ,  Zhengping Yao ,  Barry Craver

IPC分类号： G01N21/31 ,  G01N21/95 ,  G06N20/00 ,  H01L21/66

摘要： A machine learning model trained to provide metrology measurements for a substrate is provided. Training data generated for a prior substrate processed according to a prior process is provided to train the model. The training data includes a training input including a subset of historical spectral data extracted from a normalized set of historical spectral data collected for the prior substrate during the prior process. The subset of historical spectral data includes an indication of historical spectral features associated with a particular type of metrology measurement. The training data also includes a training output including a historical metrology measurement obtained for the prior substrate, the historical metrology measurement associated with the particular type of metrology measurement. Spectral data is collected for a current substrate processed according to a current process. A subset of current data extracted from a normalized set of the spectral data for the current substrate is provided as input to the trained model. Metrology measurement data for the current substrate is extracted from one or more outputs of the trained model.