- 专利标题: Method of fabricating isolation structure
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申请号: US15384940申请日: 2016-12-20
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公开(公告)号: US10199258B2公开(公告)日: 2019-02-05
- 发明人: Chieh-Te Chen , Hsien-Shih Chu , Ming-Feng Kuo , Fu-Che Lee , Chien-Ting Ho , Chiung-Lin Hsu , Feng-Yi Chang , Yi-Wang Zhan , Li-Chiang Chen , Chien-Cheng Tsai , Chin-Hsin Chiu
- 申请人: United Microelectronics Corp. , Fujian Jinhua Integrated Circuit Co., Ltd.
- 申请人地址: TW Hsinchu CN Fujian Province
- 专利权人: United Microelectronics Corp.,Fujian Jianhua Integrated Circuit Co., Ltd.
- 当前专利权人: United Microelectronics Corp.,Fujian Jianhua Integrated Circuit Co., Ltd.
- 当前专利权人地址: TW Hsinchu CN Fujian Province
- 代理机构: J.C. Patents
- 优先权: CN201610903787 20161017
- 主分类号: H01L21/762
- IPC分类号: H01L21/762 ; H01L21/308
摘要:
A method of fabricating an isolation structure is provided. A first oxide layer and a first, second, and third hard mask layers are formed on a substrate. A patterned third hard mask layer is formed. Second oxide layers are formed on sidewalls of the patterned third hard mask layer and a fourth hard mask layer is formed between the second oxide layers. The second oxide layers and the second hard mask layer are removed using the patterned third hard mask layer and the fourth hard mask layer as a mask, to form a patterned second hard mask layer. The patterned third hard mask layer and the fourth hard mask layer are removed. A portion of the patterned second hard mask layer is removed to form trench patterns. A patterned first hard mask layer and first oxide layer, and trenches located in the substrate are defined. An isolation material is formed.
公开/授权文献
- US20180108563A1 METHOD OF FABRICATING ISOLATION STRUCTURE 公开/授权日:2018-04-19
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