Semiconductor device and manufacturing method of semiconductor device
Abstract:
A mesa portion of a semiconductor device, which includes a channel base layer formed of a first nitride semiconductor layer, a channel layer formed of a second nitride semiconductor layer, a barrier layer formed of a third nitride semiconductor layer, a mesa-type fourth nitride semiconductor layer, a gate insulating film that covers the mesa portion, and a gate electrode formed over the gate insulating film, is used as a co-doped layer. The mesa portion is used as the co-doped layer, so that interface charges generated at an interface between the gate insulating film and the mesa portion can be cancelled by p-type impurity or n-type impurity in the co-doped layer and a threshold potential can be improved. Further, the fourth nitride semiconductor layer is n-type until the gate insulating film is formed, and the fourth nitride semiconductor layer is made neutral or p-type after the gate insulating film is formed.
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