Invention Grant
- Patent Title: EMI shielding structure and manufacturing method thereof
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Application No.: US15489190Application Date: 2017-04-17
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Publication No.: US10201072B2Publication Date: 2019-02-05
- Inventor: Keon Kuk , Il-ju Mun , Jin-woo Jung , Ji-woon Yeom
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0168341 20161212
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; B05B1/00 ; H05K3/28 ; H05K9/00

Abstract:
An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.
Public/Granted literature
- US20180168029A1 EMI SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-06-14
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