Invention Grant
- Patent Title: Polymers containing benzimidazole moieties as levelers
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Application No.: US15023562Application Date: 2013-11-20
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Publication No.: US10201097B2Publication Date: 2019-02-05
- Inventor: Lingli Duan , Yang Li , Tong Sun , Shaoguang Feng , Chen Chen , Zuhra Niazimbetova , Maria Rzeznik
- Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC , DOW GLOBAL TECHNOLOGIES LLC
- Applicant Address: US MA Marlborough US MI Midland
- Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US MI Midland
- Agent John J. Piskorski
- International Application: PCT/CN2013/087477 WO 20131120
- International Announcement: WO2015/074190 WO 20150528
- Main IPC: C25D3/38
- IPC: C25D3/38 ; H05K3/42 ; C25D3/02 ; C25D3/32 ; H05K3/24 ; C08G73/06 ; C25D5/56 ; C25D7/00 ; C25D7/12
Abstract:
Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
Public/Granted literature
- US20160255729A1 POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS Public/Granted day:2016-09-01
Information query
